Open Ecosystems Enables Development of TSV-enabled 3D IC Chip Stacking Technology
United Microelectronics Corporation and STATS ChipPAC announced recently that their first 3D TSV-enabled IC Chip Stacking project was successfully completed. The chip also passed their
Growing Demand for Consumer Electronics Means Great Opportunities for Mechanical Engineers
How many people do you know that have a smartphone or a tablet? Chances are, most everyone you come into contact with has at least
Does Your Engineering Hiring Strategy Need Updating?
If you’ve noticed that your recruiting efforts have become lackluster, or if you’re simply not attracting the talent you want, it may be time to
Chip Technology: Intel’s Neuromorphic Design
Even though computer chips are incredibly capable at processing and transmitting information, they’re still light years away from the capability of the human brain. Our
Engineering Trends of 2013: What to Expect From Candidates, the Industry and Technologies
As the engineering industry continues to evolve, it makes sense to stay on top of new trends and how they can impact your company. From
Engineering Trends of 2013: What to Expect From Candidates, the Industry and Technologies
As the engineering industry continues to evolve, it makes sense to stay on top of new trends and how they can impact your company. From